Location: Alhambra, CA
Position Summary: The Backend Process Engineer – InP Wafer Fab position is responsible for development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.
Responsibilities:
Backend Process Ownership and Optimization (35%):
Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTA
Establish robust process windows, recipes, and control limits for backend modules
Maintain stable manufacturing performance through continuous monitoring and improvement
Yield Improvement, Defect Reduction, and AOI Control (25%):
Own and maintain AOI processes for backend defect detection and yield monitoring
Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations
Analyze inline and post-process data to identify trends and systematic issues
Implement corrective and preventive actions and verify effectiveness
Singulation, Optical Coatings, and Packaging Interface Support (20%):
Support cleaving, dicing, and singulation processes to ensure device integrity
Provide process engineering support for AR/HR optical coatings and vendor qualifications
Collaborate with packaging, device, and reliability teams to ensure packaging readiness
New Product Introduction and Technology Support (10%):
Support new product introduction (NPI), process transfers, and technology changes
Evaluate backend process risks associated with new designs, materials, and device structures
Documentation, Process Control, and Manufacturing Support (10%)
Author and maintain SOPs, travelers, process specifications, and control plans
Define SPC metrics and control strategies for backend processes
Provide hands-on manufacturing and troubleshooting support as needed
Minimum Qualifications:
Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field
Minimum of 3+ years of experience in backend semiconductor processing
Hands-on experience with lapping/thinning, metallization, and thermal processes
Understanding of InP-based or III-V compound semiconductor wafer fabrication processes
Experience with AOI systems, yield analysis, and data-driven process improvement
Strong understanding of singulation, packaging interfaces, and reliability requirements
Proficiency in SPC, DOE, and statistical analysis
Ability to work across cross-functional manufacturing and engineering teams
Preferred experience with InP or III-V optoelectronic devices
Familiarity with AR/HR optical coating processes
Experience supporting high-mix, low-volume manufacturing environments preferred
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.
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Skills Required
- Bachelor's degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
- 3+ years of experience in backend semiconductor processing
- Hands-on experience with lapping/thinning, metallization, and thermal processes
- Understanding of InP-based or III-V compound semiconductor wafer fabrication processes
- Experience with AOI systems and yield analysis
- Strong understanding of singulation, packaging interfaces, and reliability requirements
- Proficiency in SPC, DOE, and statistical analysis
- Ability to work across cross-functional manufacturing and engineering teams
- Preferred experience with InP or III-V optoelectronic devices
- Familiarity with AR/HR optical coating processes
- Experience supporting high-mix, low-volume manufacturing environments
Semtech Compensation & Benefits Highlights
The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Semtech and has not been reviewed or approved by Semtech.
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Parental & Family Support — Up to 20 weeks of paid maternity/parental leave is highlighted in multiple regions. Enhanced leave is positioned as a core part of the package.
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Healthcare Strength — Medical, dental, and vision coverage are standard elements of the offering. Core health coverage features prominently alongside other benefits.
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Leave & Time Off Breadth — Paid vacation and time‑off programs are explicitly included. Time off is emphasized together with flexible/hybrid work policies where possible.
Semtech Insights
What We Do
Semtech Corporation is a high-performance semiconductor, IoT systems and Cloud connectivity service provider dedicated to delivering high quality technology solutions that enable a smarter, more connected and sustainable planet.
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