Summary: As Assembly Application Engineer, you will be responsible for working with internal sales, engineers, substrate manufacturers, and customers to provide technical support and solutions.
Essential Duties and Responsibilities:
- Interface with customer/factory on daily production assembly activities and engineering support
- Working closely with customers on selecting/recommending cost effective packaging solution
- Managed package design projects from concept through development, qualification, and volume production
- Work with internal sales, engineers, substrate manufacturers to provide technical solutions to customers.
- Design and document process, tooling, and assembly to meet engineering drawing requirements.
- Identify and propose cost savings, solve problems, and quickly respond to process and quality issues.
- Troubleshoot production issues and implement effective solutions.
- Investigate and participate in corrective and preventative action plans to address non-conformances.
Qualifications:
- 2-5 years related experience and/or training; or equivalent combination of education and experience.
- Knowledge of backend semiconductor package assembly process, technologies, material design rules
- Experience in semiconductor packaging
Education and/or Experience:
- Bachelor's degree in Mechanical, Chemical, Materials or Electrical Engineering
- M.S. degree preferred.
Computer Skills:
- Familiar with AutoCAD and Cadence APD
- Proficiency with MS Office (Excel, PowerPoint, Word, Outlook) is required.
Knowledge, Abilities and Skills:
- Requires considerable knowledge of: modern office methods and procedures; modern business English, spelling and arithmetic; the operations of common office machines and equipment.
- Requires considerable ability to: use good judgment in making routine decisions in accordance with existing laws, ordinances, regulations and departmental policies and procedures; establish and maintain satisfactory working relationships with departmental personnel and customers.
Other Skills and Abilities:
- Solid Communication skills
- Written/oral presentation skills are a plus
- Good organizational skills
- Project management skills
- Team problem solving
- Team player with good interpersonal skills and able to work efficiently with multi-functional group
- Ability to manage multiple activities and set priority accordingly
- Responsible and dependable
- Aggressive self-starter
Physical Demands:
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
- Must be able to lift or move 5-10 lbs. frequently.
Work Environment:
The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
- Work in Office Environment.
Skills Required
- 2-5 years of related experience and/or training, or an equivalent combination of education and experience
- Knowledge of backend semiconductor package assembly processes, technologies, and material design rules
- Experience in semiconductor packaging
- Bachelor's degree in Mechanical, Chemical, Materials, or Electrical Engineering
- Master's degree
- Familiarity with AutoCAD and Cadence APD
- Proficiency with Microsoft Office, including Excel, PowerPoint, Word, and Outlook
- Strong communication, organizational, interpersonal, and team problem-solving skills
- Project management skills and ability to manage multiple activities and priorities
- Ability to lift or move 5-10 pounds frequently
What We Do
ISE Labs is a semiconductor engineering service provider specializing in the assembly, packaging, and testing of integrated circuits (ICs). As a subsidiary of ASE, Inc., the company offers a full spectrum of services, including turnkey solutions, engineering development, production testing, device qualification, reliability, and hardware development services designed to support the semiconductor industry with scalable resources on demand.
