Analysis & Simulation Engineer

Posted 2 Days Ago
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Manikonda, Rangareddy, Telangana
Mid level
Information Technology • Internet of Things • Other • Software
The Role
The Analysis & Simulation Engineer will perform stress analysis on aerospace structures using FEA and hand calculations, validate structural designs, and generate reports. They will also collaborate with customers and participate in MRB activities to ensure design compliance and safety.
Summary Generated by Built In

Cyient is a global engineering and technology solutions company. As a Design, Build, and Maintain partner for leading organizations worldwide, we take solution ownership across the value chain to help clients focus on their core, innovate, and stay ahead of the curve. We leverage digital technologies, advanced analytics capabilities, and our domain knowledge and technical expertise, to solve complex business problems.

With over 15,000 employees globally, we partner with clients to operate as part of their extended team in ways that best suit their organization’s culture and requirements. Our industry focus includes aerospace and defence, healthcare, telecommunications, rail transportation, semiconductor, geospatial, industrial, and energy.

Job Description

Roles and Responsibilities:

  • Understand project scope including analysis domain, boundary condition, material models, type of analysis etc.
  • Perform stress analysis on aero structures / nacelle components and assemblies using finite element analysis (FEA) and classical hand calculations.
  • Perform Material Review Board (MRB) activities to assess and resolve structural non-conformities and deviations.
  • Validate structural designs for performance, safety, and cost-efficiency.
  • Generate detailed stress analysis reports and documentation
  • Co-ordinate with customers to understand scope, collect inputs and deliver results.

Mandatory skills:

  • Minimum 3 years of experience in Stress analysis of Mechanical components under minimal guidance using Nastran & Patran.
  • Should have a basic knowledge in FEA Theory, Solid mechanics, Machine design and Fatigue.
  • 2D & 3D Finite Element modeling of simple, moderate and complex components
  • Linear and non-linear static stress analysis (Geometric, Material and contact Linearity)
  • Modal, Harmonic and transient Dynamic stress analysis
  • Strength, stability and Durability of components
  • Damage tolerance analysis to estimate fracture life
  • Should able to build/update FE Models in HyperMesh.
  • Familiarity with Material Review Board (MRB) processes and regulations.
  • Strong analytical and problem-solving skills.
  • Excellent communication and presentation abilities.
  • Exposure of aerospace industry standards and regulations (e.g., FAR, EASA, etc.) is a plus.

Skills & Experience

Hypermesh, MSC Nastran, MSC Patran

Cyient is an Equal Opportunity Employer.

 

Cyient recruits, employs, trains, compensates, and promotes regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender, gender identity or expression, veteran status, and other protected status as required by applicable law. We are proud to be a diverse and inclusive company where our people can focus their whole self on solving problems that matter.

Top Skills

Hypermesh
Nastran
Patran
The Company
HQ: Hartford, CT
13,530 Employees
On-site Workplace
Year Founded: 1991

What We Do

Cyient (Estd: 1991, NSE: CYIENT) is a global engineering and technology solutions company. We engage with customers across their value chain helping to design, build, operate, and maintain the products and services that make them leaders and respected brands in their industries and markets. Customers draw on Cyient’s expertise in engineering, manufacturing, and digital technology to deliver and support their next-generation solutions that meet the highest standards of safety, reliability, and performance.

Cyient’s industry focus includes aerospace and defense, healthcare, telecommunications, rail transportation, semiconductor, geospatial, industrial, and energy.

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