As an R&D Engineer/Scientist at Solstice, you will play a critical role in developing next-generation materials and solutions that enable advanced semiconductor packaging and high-performance computing applications. You will lead the design, development, characterization, and commercialization of innovative advanced semiconductor packaging technologies, partnering closely with customers, cross-functional teams, and external partners to solve complex heat management challenges.
You will report directly to the Senior Manager R&D (Applications Development) and work closely with customers, marketing, manufacturing, technical services, and product development organizations. In this role, you will serve as both a technical expert and strategic partner, translating market needs into scalable product solutions that create value for customers and drive growth for Solstice.
Key Responsibilities
- Lead the development and commercialization of materials and technologies for advanced semiconductor packaging from concept through scale-up and commercial launch.
- Partner directly with customers to understand technical challenges, provide applications support, and identify opportunities for new product development.
- Generate applications data through simulation, modeling, and experimental testing to solve chip-level and package-level thermal management challenges.
- Collaborate with cross-functional teams including R&D, manufacturing, quality, marketing, and technical services to transition new technologies into commercial production.
- Establish material specifications and qualification requirements to support manufacturing readiness and customer adoption.
- Apply statistical analysis, Design of Experiments (DOE), and engineering methodologies to optimize product performance and process capability.
- Partner with external suppliers, research organizations, and industry partners to support technology development and roadmap alignment.
- Communicate technical findings, business recommendations, and strategic opportunities to senior leadership, customers, and external stakeholders.
MUST HAVE
- Master’s degree (Ph.D. preferred) in Material Science, Chemical Engineering, Polymer Science, or Chemistry
- 3+ years of hands-on industry or research experience in packaging module development involving innovative assembly materials—such as underfills, molding compounds, adhesives, and substrates—to enable next-generation semiconductor technologies like 2.5D/3D integration.
- Proven experience in customer engagement by bridging R&D with customer needs, by being a technical liaison to the market across a broad range of products and technologies.
WE VALUE
- Technical expertise: deep knowledge of advanced packaging architectures like flip-chip, 2.5D/3D stacking, wafer-level packaging, and heterogeneous integration. Good understanding how foundries (factories that build wafers) and OSATs (Outsourced Semiconductor Assembly and Test facilities) build and test packages. Strong knowledge of structure-property-performance correlations in polymers/metals and familiarity with failure analysis tools (SEM, X-Ray, CSAM).
- Customer Interface: Act as the technical expert to help clients optimize polymers, adhesives, and metals that hold micro-chips together. Partner with the customer in product selection and qualification in their application.
- Strategic Planning: Ability to turn complex customer problems into scalable, market-leading solutions which create value.
- Collaboration: demonstrated ability to partner with cross-functional teams involving Synthesis & Formulation R&D, manufacturing, quality and technical services to scale prototype concepts into high-volume mass production.
- Communication skills: strong ability to present complex technical data clearly to clients and internal teams.
COMPENSATION
The annual base salary range for this position is $129338k-$161085k. Please note that this salary information serves as a general guideline. Solstice Advanced Materials considers various factors when extending an offer, including but not limited to the scope and responsibilities or the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.
BENEFITS OF WORKING FOR SOLSTICE ADVANCED MATERIALS
In addition to a competitive salary, leading-edge work, and developing solutions side-by-side with dedicated experts in their fields, Solstice Advanced Materials employees are eligible for a comprehensive benefits package. This package includes employer-subsidized Medical, Dental, Vision, and Life Insurance; Short-Term and Long-Term Disability; 401(k) match, Flexible Spending Accounts, Health Savings Accounts, EAP, and Educational Assistance; Parental Leave, Paid Time Off (for vacation, personal business, sick time, and parental leave), and 12 Paid Holidays. For more information visit: click here
Solstice Advanced Materials is an equal opportunity employer. Qualified applicants will be considered without regard to age, race, creed, color, national origin, ancestry, marital status, affectional or sexual orientation, gender identity or expression, disability, nationality, sex, religion, or veteran status. Learn more about inclusion and diversity: click here
About UsAbout Solstice Advanced Materials
Solstice Advanced Materials is a leading global specialty materials company that advances science for smarter outcomes. Solstice offers high-performance solutions that enable critical industries and applications, including refrigerants, semiconductor manufacturing, data center cooling, nuclear power, protective fibers, healthcare packaging and more. Solstice is recognized for developing next-generation materials through some of the industry's most renowned brands such as Solstice®, Genetron®, Aclar®, Spectra®, Fluka™, and Hydranal™. Partnering with over 3,000 customers across more than 120 countries and territories and supported by a robust portfolio of over 5,700 patents, Solstice’s approximately 4,000 employees worldwide drive innovation in materials science. For more information, visit Advanced Materials.
Skills Required
- Master's degree in Materials Science, Chemical Engineering, Polymer Science, or Chemistry
- Ph.D. in a relevant field
- 3+ years of hands-on industry or research experience in semiconductor packaging module development
- Experience with innovative assembly materials such as underfills, molding compounds, adhesives, and substrates
- Experience supporting next-generation semiconductor technologies such as 2.5D/3D integration
- Proven customer engagement experience bridging R&D needs with customer requirements
- Technical expertise in advanced packaging architectures, foundry and OSAT processes, and structure-property-performance correlations
- Familiarity with SEM, X-Ray, and CSAM failure-analysis tools
- Experience with statistical analysis, Design of Experiments, simulation, modeling, and engineering methodologies
- Ability to collaborate with R&D, manufacturing, quality, marketing, technical services, suppliers, and research organizations
- Strong technical communication and presentation skills
What We Do
Solstice, part of Kin + Carta, is a modern software engineering firm that helps Fortune 500 companies seize new opportunities through world-changing digital solutions. As strategists and consultants, we help organizations evolve their digital strategy to solve mission-critical problems. As designers and developers, we build incredible hardware and software solutions that transcend a standalone product and transform an organization’s relationship with its customers. As instructors and coaches, we help companies transform from the inside out by adopting a high-speed culture of innovation. We’re strategists, researchers, designers, and engineers hell-bent on changing the way the world does business. We’re headquartered in Chicago and have delivery offices in New York, London, and Buenos Aires. For more information about Solstice, visit solstice.com









