Sr. Director Analog/RF/Mixed Signal IC Design & Development

Posted Yesterday
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2 Locations
Remote or Hybrid
Senior level
Software
The Role
Leads Nokia’s Analog/RF/Mixed-Signal ASIC development organization, overseeing product definition, architecture, circuit design, foundry engagement, layout, tape-out, silicon bring-up, testing, qualification, and productization. Builds and mentors technical teams, establishes design methodologies, selects circuit topologies, develops product roadmaps, and collaborates with verification, CAD, product, packaging, and test engineering partners to deliver high-performance SiGe ASIC solutions.
Summary Generated by Built In

We are seeking a highly accomplished Senior Director to lead our SiGe Analog/RF/Mixed-Signal ASIC development team.

This role requires demonstrated strategic leadership in managing complex projects and a deep technical expertise in high-performance, high-frequency, and low-noise broadband analog & RF circuit/chip design, including TX (MZMD), RX (TIA), and supporting circuits.

The ideal candidate will possess extensive experience in leading diverse technical teams, fostering innovation, and driving product development from definition through design and production in a fast-paced environment.

Responsibilities
  • Lead and mentor the Analog/RF ASIC Design Team, overseeing product definition, chip architecture, design, foundry selection/interactions, test, and productization.

  • Strategically manage and scale the team to deliver cutting-edge Analog/RF ASIC solutions crucial for Nokia’s optical engine development.

  • Implement and enforce robust design methodologies and processes to ensure the highest product quality and reliability.

  • Drive the exploration and selection of optimal circuit topologies to achieve market-leading product performance.

  • Collaborate with cross-functional teams to define comprehensive product requirements and development roadmaps.

  • Lead interactions with internal and external partners on foundry processes, packaging, test, and qualification efforts.

  • Oversee the complete IC/Chip product development lifecycle, including specification, design, layout, tape-out, silicon bring-up, test, and reliability.

  • Partner closely with verification, CAD, product, and test engineering teams to devise and execute comprehensive DVT plans and characterization.

Qualifications
  • Master's (M.S.) or Ph.D. degree in Electrical Engineering with a minimum of 15 years of progressive experience in Analog/RF ASIC design and leadership.
  • Proven track record of analog/RF/mixed-signal SiGe BICMOS, CMOS ICs first-pass success in design leading to productization.
  • Demonstrated experience in leading and developing high-performing, diverse technical teams.

  • Extensive knowledge in high-speed, high-performance, low-noise Analog/RF circuitry.

  • Strong understanding of Analog/RF/mixed signal layout techniques and best practices.

  • Solid understanding of 3D EM simulation tools.

  • Knowledge of RF wafer probing, lab equipment, and evaluation of high-speed analog ICs.

  • Strong understanding of package and board-level design optimization.

  • Fluent in verbal and written communications.

  • Demonstrated ability to independently resolve complex organizational and technical challenges.

  • Highly self-motivated, detail-oriented, and results-driven.

  • Strategic cross-functional leadership.

  • Strategic thinking and business acumen related to product roadmaps and market trends.

  • Strong problem-solving and decision-making capabilities.

Skills Required

  • Master’s degree or Ph.D. in Electrical Engineering
  • At least 15 years of progressive experience in Analog/RF ASIC design and leadership
  • Experience with SiGe BiCMOS and CMOS analog/RF/mixed-signal ICs from design through productization
  • Track record of first-pass success in IC design
  • Experience leading and developing high-performing, diverse technical teams
  • Extensive knowledge of high-speed, high-performance, low-noise analog/RF circuitry
  • Understanding of analog/RF/mixed-signal layout techniques and best practices
  • Understanding of 3D EM simulation tools
  • Knowledge of RF wafer probing, laboratory equipment, and high-speed analog IC evaluation
  • Understanding of package and board-level design optimization
  • Fluent verbal and written communication skills
  • Ability to independently resolve complex organizational and technical challenges
  • Strategic cross-functional leadership, strategic thinking, and business acumen
  • Strong problem-solving and decision-making capabilities

Nokia Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Nokia and has not been reviewed or approved by Nokia.

  • Equity Value & Accessibility Equity programs include a global employee share purchase plan with company matching and multi‑year share awards. These mechanisms broaden participation and tie rewards to long‑term outcomes.
  • Healthcare Strength Health coverage includes major medical plans with supplementary options such as vision, legal services, and care navigation. The range of offerings indicates comprehensive support for medical needs.
  • Parental & Family Support A global policy grants paid leave for new parents regardless of gender and provides structured return‑to‑work support. Company‑paid life insurance further strengthens family protection across regions.

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The Company
HQ: Espoo
132,624 Employees

What We Do

At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.

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