We’re looking for a Principal RFIC Design Engineer - Chip Lead to own top-level integration of our next-generation multi-channel beamformer ICs. You’ll drive chip architecture, floorplanning, block integration, top-level RF/analog performance, physical implementation, package interfaces, and tapeout readiness across RF, analog, digital, layout, and test functions.
This is a senior technical leadership role for an experienced IC designer who can see the whole chip. You’ll work directly with the founding engineers and block owners to turn system requirements into a manufacturable, testable product and drive execution from architecture and floorplan through sign-off, silicon bring-up, and customer deployment.
Skills Required
- Experienced IC designer capable of leading chip-level RFIC integration from architecture and floorplan through sign-off, silicon bring-up, and deployment.
What We Do
Oso Semiconductor is a fabless semiconductor company developing high-performance beamforming chipsets and ultra-low-loss RFIC technology for electrically steered, phased-array antennas. Its products target wireless communication and sensing applications, including satellite communications, 5G/6G, radar, and defense. The company’s architecture is designed to reduce power, size, weight, and cost while improving interference resilience and enabling more capable, compact phased-array systems across commercial and mission-critical markets.
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