Internship Germany

Reposted One Month Ago
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Nürnberg, Bayern, DEU
Hybrid
Internship
Information Technology
The Role
Work as an intern in the CTO Office on optical and electronic packaging projects: evaluate packaging architectures, analyze assembly tolerances and alignment, perform thermal modeling (including liquid cooling), develop test methodologies and characterization setups, support CAD and simulation-based package design, and participate in reliability studies. Opportunity to complete a Bachelor’s or Master’s thesis with structured mentoring.
Summary Generated by Built In

Internship Germany

CTO Office - Nürnberg

Join Ranovus for an Internship or to complete your Bachelor’s or Master’s thesis.

Location: Nuremberg, Germany [Hybrid]

Company: Ranovus – Innovating the Future of Data Centre Connectivity


About Us

At Ranovus, we’re powering the next generation of data centre infrastructure with cutting-edge fiber-optic communication technologies. With operations in Ottawa (Canada), Nuremberg (Germany), and San Jose (USA), we’re on a mission to deliver high-performance solutions that reduce environmental impact through lower power consumption.

What We Are Offering

We offer students a unique opportunity to gain hands-on experience with advanced technologies for optical and electronic systems, including heterogeneous integration, chiplet architectures, high-speed interconnect technologies. Interns will contribute to real development projects while working closely with experienced engineers and researchers.

The ideal candidate is pursuing a Bachelor's or Master's degree in Physics, Optical Systems, Electrical Engineering, Mechatronic, or a related field. Knowledge of engineering software such as ANSYS (Zemax), COMSOL, SolidWorks, MATLAB, Python, or equivalent simulation and design environments is beneficial.

Additionally, we are open to supporting students in completing their Bachelor’s or Master’s thesis at Ranovus, based on an industry-relevant topic.

The intern will contribute to several of the following activities:

Evaluation of advanced packaging architectures for photonic and electronic integrated circuits:

  • Analysis of assembly tolerances and alignment requirements for photonic devices.
  • Thermal modeling and assessment of package concepts, including liquid cooling solutions.
  • Development of test methodologies and characterization setups.
  • Support of package design activities using CAD and simulation tools.
  • Participation in reliability studies including thermal cycling, power cycling, and environmental testing.

Benefits

  • International work environment
  • Innovative, research-driven projects in optical and electronic packaging
  • Direct involvement in real development projects with impact
  • Structured mentoring and feedback, with the option for long-term collaboration (e.g. follow-up internship, thesis, or entry position)
  • Competitive internship compensation in line with your qualifications and study level

 

Skills Required

  • Currently pursuing a Bachelor's or Master's degree in Physics, Optical Systems, Electrical Engineering, Mechatronics, or a related field
  • Knowledge of ANSYS
  • Knowledge of Zemax
  • Knowledge of COMSOL
  • Knowledge of SolidWorks
  • Knowledge of MATLAB
  • Knowledge of Python
  • Experience with CAD and simulation/design environments
  • Interest or experience in photonic/electronic packaging, thermal modeling, and reliability testing
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The Company
HQ: Ottawa, Ontario
83 Employees
Year Founded: 2012

What We Do

The world-class team of scientist and engineers at Ranovus is comprised of professionals with a unique combination of decades of expertise in product development of optoelectronics components and transceiver subsystems for the information technology industry. Ranovus'​ disruptive innovation in Quantum Dot Multi-Wavelength Laser combined with advanced digital and photonics integrated circuit technologies is setting a new industry benchmark for the next generation of optical interconnect solutions. Our technology delivers significant reduction in power dissipation, size and cost of interconnects, and enables a much higher degree of distortion tolerance compared to traditional solutions, thereby enabling a "freeway"​ architecture to reduce network latency.

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