Electrical CM Support Engineer - Operations Engineering Team

Posted 10 Hours Ago
Be an Early Applicant
3 Locations
Remote or Hybrid
Entry level
Software
The Role
Develop, qualify, and sustain advanced electronic assembly and interconnect processes from NPI through volume manufacturing. Responsibilities include optimizing SMT, soldering, flip-chip, underfill, die attach, and packaging processes; conducting DOE, capability studies, inspections, reliability testing, and root-cause analysis; improving yield, quality, and cost; and creating manufacturing documentation while collaborating with design teams, suppliers, contract manufacturers, and factories.
Summary Generated by Built In

Join our Engineering Operations Team as an Electrical CM Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis.

In this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.

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Responsibilities
  • Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
  • Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
  • Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
  • Conduct process characterization, Design of Experiments (DOE), and process capability studies.
  • Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
  • Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
  • Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
  • Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
  • Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
  • Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.
Qualifications
  • BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
  • Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
  • Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
  • Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
  • Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.

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About Us
Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. 

Learn more about life at Nokia.


Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia. 

About the Team

Some of our benefits in India:

  • Flexible and hybrid working arrangements to support work–life balance
  • Health and well-being support – medical insurance for you and your family, health check-ups, life and accident insurance, well-being programs, and employee resource groups 
  • A minimum of 90 days of Maternity and Paternity Leave based on eligibility
  • Personal Support Service 24/7 – a confidential support channel open to all Nokia employees and their families in challenging situations
  • Career growth & mobility – technical career paths, job rotations, international assignments, and relocation support
  • Continuous learning – technical certifications, mentoring programs, coaching, and digital learning platforms
  • Opportunities to innovate and contribute through Nokia’s research and development environment
  • Recognition programs that celebrate outstanding contributions
  • Workplace support – ergonomic working support and mobile device programs based on eligibility

Skills Required

  • BS, MS, or PhD in Electrical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related field
  • Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies
  • Hands-on experience with laser soldering, flip-chip, underfill, die attach, and other advanced interconnect or packaging technologies
  • Experience with X-ray inspection, cross-section analysis, solder joint characterization, and failure or root-cause investigations
  • Experience with semiconductor packaging, silicon photonics, RF or optical modules, and advanced failure analysis techniques
  • Familiarity with SEM, EDS, FIB, and Industry 4.0 or automation

Nokia Compensation & Benefits Highlights

The following summarizes recurring compensation and benefits themes identified from responses generated by popular LLMs to common candidate questions about Nokia and has not been reviewed or approved by Nokia.

  • Equity Value & Accessibility — Equity programs include a global employee share purchase plan with company matching and multi‑year share awards. These mechanisms broaden participation and tie rewards to long‑term outcomes.
  • Healthcare Strength — Health coverage includes major medical plans with supplementary options such as vision, legal services, and care navigation. The range of offerings indicates comprehensive support for medical needs.
  • Parental & Family Support — A global policy grants paid leave for new parents regardless of gender and provides structured return‑to‑work support. Company‑paid life insurance further strengthens family protection across regions.

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The Company
HQ: Espoo
132,624 Employees

What We Do

At Nokia, we create technology that helps the world act together. As a trusted partner for critical networks, we are committed to innovation and technology leadership across mobile, fixed and cloud networks. We create value with intellectual property and long-term research, led by the award-winning Nokia Bell Labs. Adhering to the highest standards of integrity and security, we help build the capabilities needed for a more productive, sustainable and inclusive world.

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