Req. 499
SUMMARY: The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of ASE’s specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engagement with customer engineers and technologists across their global organizations from IC design, package and system architects, manufacturing and market applications, as well as through conferences and industry forums. This position serves as the critical bridge between market demand and technology innovation, translating customer product roadmaps and industry trends into packaging technology strategies and business opportunities through deep technical dialogue, early-stage architecture influence, and ecosystem collaboration.
Working in close partnership with Sales, Factory engineering, and R&D teams, the Director aligns customer requirements with technology development roadmaps and ASE’s packaging innovation strategy. Advise ASE factory engineering teams on technology innovations and technology qualifications in collaboration with foundry partners, equipment suppliers, materials providers, and industry consortia to strengthen ASE’s leadership in heterogeneous integration technology. The ultimate objective is to represent ASE in industry forums, conferences, and consortia to expand strategic customer partnerships and translate advanced packaging technology leadership into sustained revenue growth and market differentiation.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following: other duties may be assigned. The Director, Engineering & Technical Marketing, is responsible for the promotion of strategic technology platforms to global customers. This role provides technical leadership in engagements with customer engineering organizations, including design, technology, and product development. The Director works closely with ASE factory engineering, R&D, and Sales to align customer technology requirements with ASE development roadmaps and business growth objectives.
The successful candidate must be a persuasive communicator capable of engaging both technical and business audiences within ASE as well as external partners, customers, and industry professionals. The role includes representing ASE at industry events, conferences, and technical forums to promote ASE’s capabilities, technology leadership, and competitive advantages.
Other responsibilities include:
- Develop technology and service promotion strategies with key customers by understanding their business drivers, IC applications, system architectures, and market positions
- Create technical marketing materials (presentations, white papers, and technical briefings) to effectively communicate ASE’s capabilities and technology differentiation
- Deliver technical presentations and engage with customer design, packaging, and system teams to promote and position ASE’s technologies for next-generation products
- Collaborate with ASE application engineering and Sales to promote ASE’s technical capabilities, roadmaps, and manufacturing strengths
- Facilitate communication between customers and internal engineering teams to address technology gaps and support product deployment. Contribute to long-term roadmap development with ASE manufacturing and R&D organizations
- Advise internal stakeholders on customer technology trends, competitive positioning, and key technical issues
- Drive technology engagements that lead to new business opportunities and design wins, increasing adoption of ASE’s strategic platforms
- Support executive management in shaping long-term advanced packaging technology and business strategies
EDUCATION and/or EXPERIENCE: ASE prefers candidates with a Bachelor’s, Master’s, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or a related field, with 12+ years of semiconductor industry experience, preferably in semiconductor packaging or advanced packaging technologies.
Candidates should have experience managing strategic customer accounts and strong verbal, written, and interpersonal communication skills. The role requires the ability to deliver technical presentations, develop customer proposals, and provide structured progress reports. Strong organizational and computer skills are required.
Additional qualifications include:
- Proven ability to analyze technology and market trends to define and execute short-term and long-term business strategies
- Strong understanding of semiconductor device physics, packaging technologies, and manufacturing processes, including flip chip, bumping, 2.5D/3D, high-density fan-out, and silicon photonics integration
- Familiarity with emerging trends such as chiplet integration, advanced interconnects, substrate innovations, electrical and thermo-mechanical performance optimization, and advanced manufacturing processes
- Knowledge of packaging reliability, defect analysis, and qualification processes
- Experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels
- Experience with DOE methodologies, BOM development, and thermo-mechanical assessments
- Working knowledge of engineering simulation tools (e.g., FEA, HFSS, CFD, Cadence APD) is a plus
- Proven strong ability to work independently and collaborate effectively with customers, vendors, and internal teams to develop and support advanced packaging technologies
- Active participation in industry networks or professional societies is highly desirable
GENERAL QUALIFICATIONS: To perform this job successfully, an individual must be able to perform each essential duty satisfactorily and demonstrate flexibility and adaptability in a dynamic environment. The requirements listed above are representative of the knowledge, skills, and abilities required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions. The successful candidate should demonstrate:
- Excellent written and verbal communication skills
- Strong teamwork and collaboration capabilities
- Ability to quickly learn new technologies and industry developments
- Ability to follow directions while also working independently
- Strong organizational and problem-solving skills
SUPERVISORY RESPONSIBILITIES: This position should have supervisory skills.
COMMUNICATION SKILLS: Excellent written and verbal communication skills are required. The candidate must be comfortable communicating with both technical and business audiences. Fluency in English is required. Mandarin proficiency is a plus
COMPUTER/SOFTWARE SKILLS/KNOWLEDGE: Proficient in MS Outlook, Word, Excel, and PowerPoint
MATHEMATICAL SKILLS: Must have basic math skills.
TRAVEL: This position requires both domestic and international travel
REASONING ABILITY: The candidate must be capable of working independently, analyzing complex technical and business situations, and making sound decisions to support technology development and customer engagement strategies
PHYSICAL DEMANDS: The physical demands described here are representative of those required to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform these functions
WORK ENVIRONMENT: The work environment characteristics described here are representative of those encountered while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform these functions.
COMPANY BENEFITS: ASE (U.S.) INC. provides a comprehensive benefit package to all its full-time employees: Medical, Dental, Vision, Prescription, Flex Plan & Life Insurance. Eligibility for enrollment in our 401 (k) Plan after successfully completing your 90-day introductory period
We are an equal opportunity employer. All applicants will be considered for employment without attention to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran status, or disability status.
Skills Required
- Bachelor’s, master’s, or Ph.D. in electrical, materials, mechanical, or chemical engineering, physics, or a related field
- 12+ years of semiconductor industry experience, preferably in semiconductor or advanced packaging
- Experience managing strategic customer accounts
- Strong verbal, written, interpersonal, and presentation skills
- Ability to develop customer proposals and structured progress reports
- Understanding of semiconductor device physics, packaging technologies, and manufacturing processes
- Knowledge of flip chip, bumping, 2.5D/3D integration, high-density fan-out, and silicon photonics integration
- Knowledge of packaging reliability, defect analysis, and qualification processes
- Experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels
- Experience with DOE methodologies, BOM development, and thermo-mechanical assessments
- Ability to analyze technology and market trends and define business strategies
- Ability to collaborate with customers, vendors, internal engineering teams, sales, and R&D
- Proficiency with Microsoft Outlook, Word, Excel, and PowerPoint
- Fluency in English
- Mandarin proficiency
- Working knowledge of FEA, HFSS, CFD, or Cadence APD
- Active participation in industry networks or professional societies
- Willingness and ability to travel domestically and internationally
What We Do
ASE (Advanced Semiconductor Engineering, Inc), a member of ASE Technology Holdings (NYSE:ASX) is one of the world's largest providers of outsourced semiconductor manufacturing services in assembly and test (OSAT), and, a leading provider of electronic manufacturing services (EMS) through its sister company, USI. Addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE is strategically integrating synergies between its well established OSAT and EMS business units. ASE is at the forefront of a new class of EMS that delivers modularized, miniaturized ICs with system-level precision to enable high-performance and highly integrated devices. As a result, ASE is truly bridging the gap between silicon and system makers. From traditional semiconductor players to players innovating applications within IoT, wearables, automotive, AR/VR, connectivity and many more, success within an increasingly dynamic market hinges on creating and sustaining highly productive manufacturing partnerships. ASE has proven ability to collaborate closely with customers, to understand markets and create value propositions, and to deliver advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. Manufacturing facilities are strategically located within key electronics manufacturing hubs, including Taiwan, China, Korea, Japan, Malaysia, and Singapore. Serving customers across the global electronics ecosystem, regional sales offices are located in Sunnyvale (USA), Brussels (Europe), Hsinchu (Taiwan), Shanghai/Beijing (China), Shenzhen (China), Yokohama (Japan), Gyeonggi-do (Korea) and Singapore.
