Technical Lead at HCL Technologies (Cincinnati, OH)

| Cincinnati, OH
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Job Description (Posting)

Technical knowledge of packaging processes, materials and methods to address technical issues in package engineering Assist in the development of new or revised packages Develop packaging specifications and documentation. Responsible for packaging line trials and package testing to support product release (1.) To be responsible for providing technical guidance or solutions (2.) To develop and guide the team members in enhancing their technical capabilities and increasing productivity (3.) TO ensure process compliance in the assigned module, and participate in technical discussionsorreview. (4.) To prepare and submit status reports for minimizing exposure and risks on the project or closure of escalations.

Qualification

B Tech, B.E

Skill (Primary)

Domain Competencies (ERS)-Industrial Engineering-Packaging and Shipping Design
More Information on HCL Technologies
HCL Technologies operates in the Information Technology industry. The company is located in New York, NY, Irvine, CA and Sunnyvale, CA. HCL Technologies was founded in 1991. It has 184139 total employees. To see all 245 open jobs at HCL Technologies, click here.
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