Integration Engineer

| Phoenix – Mesa – Scottsdale, AZ
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Job Description

Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units for external customers working with Intel for internal package, assembly and test deals. You will have an opportunity to directly engage with customers in defining product package and assembly requirements and be part of driving IDM 2.0 execution.

This is an opportunity to be part of a critical team chartered to deliver Industry leading solutions to enable IDM 2.0.
  • Responsible for delighting IFS customers by driving their package, assembly and test projects through completion.
  • Be a voice for IFS customers within Intel and drive assembly and test road maps to meet their requirements.
  • Drive test chip assembly for enabling CEOs vision for IDM 2.0
  • Establish material specifications for contract assemblies and raw material vendors and interface with Quality Assurance and Purchasing regarding material quality and vendor performance
  • Respond to customer/client requests and issues when they occur and work with stake holders to deliver solutions that delight our customers.
  • Develop solutions to problems utilizing formal education and previous experience.


Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
  • Bachelors degree in Engineering with 3+ years experience in micro-electronic manufacturing.


Preferred Qualifications:
  • 2+ years experience in ATTD


Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

US Tech Grad JR0207674 Phoenix Technology and Manufacturing
More Information on Intel Corporation
Intel Corporation operates in the Artificial Intelligence industry. The company is located in Santa Clara, CA, Santa Clara, CA, Folsom, CA, Hillsboro, OR, Hillsboro, OR, Irvine, CA, Chandler, AZ and Chandler, AZ. Intel Corporation was founded in 1968. It has 141941 total employees. It offers perks and benefits such as Flexible Spending Account (FSA), Disability Insurance, Dental Benefits, Vision Benefits, Health Insurance Benefits and Life Insurance. To see all 315 open jobs at Intel Corporation, click here.
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