Experienced Advanced Microelectronics Packaging EngineerCompany:The Boeing CompanyJob ID:00000270418Date Posted:2021-12-06-08:00Location:USA - Huntington Beach, CAJob Description Qualifications: @Boeing, we create the future - of mobility, autonomy, speed, endurance, space access and exploration, undersea vehicles, cybersecurity, communication and much, much more. We connect people, products and ideas around the world. We protect people and nations. We explore the mysteries of the universe from seabed to space to cyberspace. We inspire future generations of innovators, dreamers and doers.We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators addressing and enabling advanced applications in quantum computing, autonomy, surveillance, radar/communications, etc. In joining us you will work in a casual but professional environment with multi-disciplined teams of engineers that take pride in developing, integrating, testing and delivering innovative solutions. We offer long-term potential for career growth into both technical leadership and/or management positions and highly value the curiosity, tenacity and imagination our engineers bring to our teams each day.#TheFutureIsBuiltHere #ChangeTheWorldWithin BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe. SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house. SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conduct research, design, and test microelectronics hardware in support of these projects. You won't be bored in our group! Join us and put your passion, determination, and skill to work building the future!We are seeking experienced engineers and engineering leaders with a strong background in the current SOTA for advance packaging as it relates to microelectronics. A successful candidate will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability.Positions available for levels 4&5This position allows for a hybrid work arrangement which is a combination of remote and on site work, generally includes routinely working virtually one or more days per week, schedules may vary by week depending on need to be on-site for test activities and/or for access to closed areas.Position Responsibilities:

• Leads analysis of customer and system requirements, development of architectural approaches, and detailed specifications for various electronic products
• Leads reviews of testing and analysis activity to assure compliance to requirements
• Leads activities in support of Supplier Management with make/buy recommendations and other technical services
• Coordinates engineering support throughout the lifecycle of the product
• Resolves complex issues on critical programs related to architectural approaches, requirements, specifications and design
• Leads technical aspect of proposal preparation
• Identifies critical performance measures and develops processes for computing them.
• Develops new concepts for future product designs to meet projected requirements

This position requires the ability to obtain a U.S Security Clearance for which the US Government requires US Citizenship. An interim and/or final US Secret clearance Post Start is requiredBasic Qualifications (Required Skills/Experience):

• Bachelor's, Master's or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
• 10+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etc
• Understanding of impacts of complex packaging architectures on circuit performance including speed, thermal, etc
• Experience with SWaP-C constrained electronics development
• Demonstrated track record as a self-motived, independent, high-performance team member
• Excellent verbal and written communication ability

Preferred Qualifications (Desired Skills/Experience):

• Understanding and experience with design, development and testing of advanced packaging techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products.
• Understanding of 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations.
• Understanding of commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and PCB manufacturing processes
• Experience with industry standards for high-speed interconnects
• Hold patents in advanced microelectronics packaging architectures and performance improvements
• Experience working building and managing Outsourced Assembly and Test (OSAT) vendor supply chain
• Experience organizing and leading cross-functional engineering teams including internal and external organizations
• Experience supporting proposals (technical, cost, and schedule) with advanced microelectronics packaging content
• Experience with technical, cost, and schedule management
• Experience supporting military programs including engagement with customers
• Active security clearance

Typical Education/Experience: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.Relocation: This position offers relocation based on candidate eligibility.Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.Shift: This position is for first shiftBoeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.Relocation:Relocation is available for eligible candidates, if authorizedExport Control Requirement:Safety Sensitive:This is not a safety sensitive positionContingent Upon Award ProgramThis position is not contingent upon program awardExperience Level:Individual Contributor - 4Job Type:RegularJob Code:6B1DI4 (64Y)Equal Employment Opportunity:Stay safe from recruitment fraud! The only way to apply for a position at Boeing is via our Careers website.Learn how to protect yourself from recruitment fraud - Recruitment Fraud WarningBoeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.Request an Accommodation - Requesting Interview AccommodationsApplicant Privacy - Applicant PrivacyEEO is the law Poster - EEO is the lawBoeing Policy on EEO - Boeing EEO PolicyAffirmative Action and Harassment - Boeing Affirmative Action and HarassmentBoeing Participates in E - Verify

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