Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
For more than 43 years, Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.
As an HBM Design Architect, you will be responsible for the design & development of next generation HBM DRAM products. You will be part of a highly cross-functional team of technical subject matter experts collaborating closely with a global team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best in class performance, power, cost, reliability and quality for Micron's HBM product portfolio.
Responsibilities will include, but are not limited to:

• Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures

• Engage with Customers to support issues with current HBM architectures and identify opportunities to innovate on future HBM solutions
• Pathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analyses
• Focus areas within team will include memory array architectures, on-die and off-die high speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies and thermal modeling

Successful candidates for this position will have:

• Familiarity with DRAM operation and JEDEC specifications, preferably with HBM product family
• Extensive experience with CMOS circuit design and good understanding of semiconductor device physics
• Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations
• In depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
• Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership

• Strong track record of innovation and problem-solving in high-performance memory development
• Bonus - Good understanding of Memory subsystem operation in high-performance computing applications
• Bonus - Prior experience with RTL Design flow, in DRAM process or Foundry process
• Bonus - Prior experience with DRAM product bring-up and debug
• Bonus - Prior experience with package technologies (TSV, hybrid bonding, interposers, etc)

Required Experience:

• BSEE or greater
• 10+ years of relevant Engineering or Design Engineering experience

Job title and level can scale depending on experience and qualifications
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
Please note that in order to assist in providing a safe and healthy workplace for all Micron team members, new employment offers for jobs based in India, Malaysia, Singapore, and the U.S., are contingent upon the applicant's provision of a copy of their COVID-19 vaccination document to Micron on a confidential basis prior to their scheduled start date confirming that they have completed the COVID-19 vaccination process, subject to any written request for medical or religious accommodation and to the extent permitted by applicable law.
For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at [email protected] or 1-800-336-8918
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.